Oprins, J.: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Oprins, Herman, Cherman, Vladimir, Webers, Tomas, Salahouelhadj, Abdellah, Kim, Soon-Wook, Peng, Lan, Van der Plas, Geert, Beyne, Eric

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 2.67 MB

english, 2017

2

Calculation of three-dimensional flow and pressure fields in cracking furnaces

A.J.M. Oprins, G.J. Heynderickx

Journal:

Chemical Engineering Science

Year:

2003

Language:

english

File:

PDF, 896 KB

english, 2003

3

[IEEE 2011 IEEE Custom Integrated Circuits Conference - CICC 2011 - San Jose, CA, USA (2011.09.19-2011.09.21)] 2011 IEEE Custom Integrated Circuits Conference (CICC) - DRAM-on-logic Stack – Calibrated thermal and mechanical models integrated into PathFinding flow

Milojevic, Dragomir, Oprins, Herman, Ryckaert, Julien, Marchal, Paul, Van der Plas, Geert

Year:

2011

Language:

english

File:

PDF, 1.85 MB

english, 2011

4

Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics

Wei, Tiwei, Oprins, Herman, Cherman, Vladimir, Beyne, Eric, Baelmans, Martine

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 2.02 MB

english, 2019

5

Spatial Disorientation Survey Among Military Pilots

Pennings, Helena J.M., Oprins, Esther A.P.B., Wittenberg, Hans, Houben, Mark M.J., Groen, Eric L.

Journal:

Aerospace Medicine and Human Performance

Year:

2020

File:

PDF, 536 KB

2020

6

Three-dimensional flow patterns in cracking furnaces with long-flame burners

Geraldine J. Heynderickx, Arno J. M. Oprins, Guy B. Marin, Erik Dick

Journal:

Year:

2001

Language:

english

File:

PDF, 1.14 MB

english, 2001

7

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions

Van der Plas, Geert, Thijs, Steven, Linten, Dimitri, Katti, Guruprasad, Limaye, Paresh, Mercha, Abdelkarim, Stucchi, Michele, Oprins, Herman, Vandevelde, Bart, Minas, Nikolas, Cupac, Miro, Dehan, Mori

Year:

2010

Language:

english

File:

PDF, 877 KB

english, 2010

8

On-Chip Liquid Cooling With Integrated Pump Technology

Oprins, Herman, Van der Veken, Geert, Nicole, Cline C. S., Lasance, Clemens J. M., Baelmans, Martine

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 850 KB

english, 2007

9

Influence of Field-Plate Configuration on Power Dissipation and Temperature Profiles in AlGaN/GaN on Silicon HEMTs

Sodan, Vice, Oprins, Herman, Stoffels, Steve, Baelmans, Martine, De Wolf, Ingrid

Journal:

IEEE Transactions on Electron Devices

Year:

2015

Language:

english

File:

PDF, 1.50 MB

english, 2015

10

The game-based learning evaluation model (GEM): measuring the effectiveness of serious games using a standardised method

Oprins, Esther, Visschedijk, Gillian, Roozeboom, Maartje Bakhuys, Dankbaar, Mary, Trooster, Wim, Schuit, Stephanie C.E.

Journal:

International Journal of Technology Enhanced Learning

Year:

2015

Language:

english

File:

PDF, 1.45 MB

english, 2015

11

The effectiveness of three serious games measuring generic learning features

Bakhuys Roozeboom, Maartje, Visschedijk, Gillian, Oprins, Esther

Journal:

British Journal of Educational Technology

Year:

2015

Language:

english

File:

PDF, 470 KB

english, 2015

12

TISSUE CULTURE STRATEGIES FOR GENETIC IMPROVEMENT OF BAMBOO

Gielis, J., Peeters, H., Gillis, K., Oprins, J., Debergh, P.C.

Journal:

Acta Horticulturae

Year:

2001

Language:

english

File:

PDF, 2.64 MB

english, 2001

13

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Oprins, Herman, Cherman, Vladimir, Van der Plas, Geert, De Vos, Joeri, Beyne, Eric

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 5.72 MB

english, 2016

14

Modeling and Control of Electrowetting Induced Droplet Motion

Oprins, Herman, Vandevelde, Bart, Baelmans, Martine

Journal:

Year:

2012

Language:

english

File:

PDF, 781 KB

english, 2012

15

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal Performance Comparison of Advanced 3D Packaging Concepts for Logic and Memory Integration in Mobile Cooling Conditions

Oprins, Herman, Cherman, Vladimir, Beyne, Eric

Year:

2018

Language:

english

File:

PDF, 3.96 MB

english, 2018

16

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges

Wei, Tiwei, Oprins, Herman, Cherman, Vladimir, De Wolf, Ingrid, Beyne, Eric, Yang, Shoufeng, Baelmans, Martine

Year:

2018

Language:

english

File:

PDF, 871 KB

english, 2018

17

Measuring adaptability demands of jobs and the adaptability of military and civilians

Oprins, Esther A. P. B., Bosch, Karel van den, Venrooij, W.

Journal:

Military Psychology

Year:

2018

Language:

english

File:

PDF, 1.24 MB

english, 2018

18

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Wei, Tiwei, Oprins, Herman, Cherman, Vladimir, Beyne, Eric, Baelmans, Martine

Journal:

Year:

2019

Language:

english

File:

PDF, 10.77 MB

english, 2019

19

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications

Croes, K., Simons, V., Beyne, S., Cherman, V., Oprins, H., Stucchi, M., Absil, Ph., Glabman, A., Wilcox, E.

Year:

2019

Language:

english

File:

PDF, 726 KB

english, 2019

20

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

Wei, T.W., Oprins, H., Cherman, V., Beyne, E., Baelmans, M.

Journal:

Applied Thermal Engineering

Year:

2020

Language:

english

File:

PDF, 6.32 MB

english, 2020

21

Competence retention in safety-critical professions: A systematic literature review

Vlasblom, Jeanine I.D., Pennings, Helena J.M., van der Pal, Jelke, Oprins, Esther A.P.B.

Journal:

Educational Research Review

Year:

2020

File:

PDF, 2.43 MB

2020

22

Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns

Wei, T.W., Oprins, H., Fang, Liang, Cherman, V., De Wolf, I., Beyne, E., Baelmans, M.

Journal:

Applied Thermal Engineering

Year:

2020

File:

PDF, 4.91 MB

2020

23

Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling

H. Oprins, J. Danneels, B. Van Ham, B. Vandevelde, M. Baelmans

Journal:

Microelectronics Journal

Year:

2008

Language:

english

File:

PDF, 1.15 MB

english, 2008

24

Fine grain thermal modeling and experimental validation of 3D-ICs

H. Oprins, A. Srinivasan, M. Cupak, V. Cherman, C. Torregiani, M. Stucchi, G. Van der Plas, P. Marchal, B. Vandevelde, E. Cheng

Journal:

Microelectronics Journal

Year:

2011

Language:

english

File:

PDF, 1.84 MB

english, 2011

25

The ER to Golgi Interface is the Major Concentration Site of Secretory Proteins in the Exocrine Pancreatic Cell

Ad Oprins, Catherine Rabouille, George Posthuma, Judith Klumperman, Hans J. Geuze, Jan W. Slot

Journal:

Year:

2001

Language:

english

File:

PDF, 488 KB

english, 2001

26

Neuropeptide Y inhibits ion secretion in intestinal epithelium by reducing chloride and potassium conductance

Hetty Bouritius, Judith C. J. Oprins, René J. M. Bindels, Anita Hartog, J. A. Groot

Journal:

Pflügers Archiv European Journal of Physiology

Year:

1997

Language:

english

File:

PDF, 598 KB

english, 1997

27

Somatic embryogenesis from matureBambusa balcooaRoxburgh as basis for mass production of elite forestry bamboos

Koen Gillis, Johan Gielis, Hilde Peeters, Emmy Dhooghe, Jan Oprins

Journal:

Plant Cell, Tissue and Organ Culture

Year:

2007

Language:

english

File:

PDF, 321 KB

english, 2007

28

Tumor Necrosis Factor-α Potentiates Ion Secretion Induced by Muscarinic Receptor Activation in the Human Intestinal Epithelial Cell Line HT29cl.19A

JUDITH C. J. OPRINS, HELEN P. MEIJER, JACK A. GROOT

Journal:

Annals of the New York Academy of Sciences

Year:

2000

Language:

english

File:

PDF, 1.98 MB

english, 2000

29

Improved Thermal Performance of AlGaN/GaN HEMTs by an Optimized Flip-Chip Design

Das, J., Oprins, H., Hangfeng Ji, Sarua, A., Ruythooren, W., Derluyn, J., Kuball, M., Germain, M., Borghs, G.

Journal:

IEEE Transactions on Electron Devices

Year:

2006

Language:

english

File:

PDF, 418 KB

english, 2006

30

Neuropeptide Y inhibits the protein kinase C-stimulated Cl− secretion in the human colonic cell line HT29cl.19A cell line via multiple sites

Judith C.J. Oprins, Hetty Bouritius, Rajesh B. Bajnath, Jack A. Groot

Journal:

European Journal of Pharmacology

Year:

2001

Language:

english

File:

PDF, 111 KB

english, 2001

31

[IEEE 2012 IEEE 38th Photovoltaic Specialists Conference (PVSC) - Austin, TX, USA (2012.06.3-2012.06.8)] 2012 38th IEEE Photovoltaic Specialists Conference - Thermal effects due to environmental variables in photovoltaic cells

Muthirayan, Buvaneshwari, Appels, Reinhart, Oprins, Herman, Chatterjee, Urmimala, Catthoor, Francky, Driesen, Johan, Baert, Kris

Year:

2012

Language:

english

File:

PDF, 374 KB

english, 2012

32

Testicular descent: Androgen receptors in cultured porcine gubernaculum cells

A.C. Oprins, J.M.Fentener van Vlissingen, M.A. Blankenstein

Journal:

Journal of Steroid Biochemistry

Year:

1988

Language:

english

File:

PDF, 451 KB

english, 1988

33

Stimulation of Endocytosis and Actin Dynamics by Oskar Polarizes the Drosophila Oocyte

Nathalie Vanzo, Adrian Oprins, Despina Xanthakis, Anne Ephrussi, Catherine Rabouille

Journal:

Developmental Cell

Year:

2007

Language:

english

File:

PDF, 2.09 MB

english, 2007

34

Development of antibodies against pneumococcal proteins α-enolase, immunoglobulin A1 protease, streptococcal lipoprotein rotamase A, and putative proteinase maturation protein A in relation to pneumococcal carriage and Otitis Media

Peter V Adrian, Debby Bogaert, Maartje Oprins, Satu Rapola, Mika Lahdenkari, Terhi Kilpi, Ronald de Groot, Helena Käyhty, Peter W.M Hermans

Journal:

Year:

2004

Language:

english

File:

PDF, 68 KB

english, 2004

35

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Van der Plas, G., Limaye, P., Loi, I., Mercha, A., Oprins, H., Torregiani, C., Thijs, S., Linten, D., Stucchi, M., Katti, G., Velenis, D., Cherman, V., Vandevelde, B., Simons, V., De Wolf, I., Labie,

Journal:

IEEE Journal of Solid-State Circuits

Year:

2011

Language:

english

File:

PDF, 4.60 MB

english, 2011

36

Wat zeggen ze?

Cees Oprins, Henk Nies

Journal:

Year:

2012

Language:

dutch

File:

PDF, 928 KB

dutch, 2012

37

Tumor necrosis factor a potentiates ion secretion induced by histamine in HT29cL.19A cells via the phospholipase D pathway

Judith C. Oprins, Helen P. Meijer, Claudia van der Burg, Teun Munnik, Jack A. Groot

Journal:

Gastroenterology

Year:

2000

Language:

english

File:

PDF, 186 KB

english, 2000

38

Design of Test Structures for the Characterization of Thermal–Mechanical Stress in 3D-Stacked IC

Minas, N., Van der Plas, G., Oprins, H., Yang, Y., Okoro, C., Mercha, A., Cherman, V., Torregiani, C., Perry, D., Cupak, M., Rakowski, M., Marchal, P.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2012

Language:

english

File:

PDF, 7.38 MB

english, 2012

39

[IEEE 2011 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2011.12.5-2011.12.7)] 2011 International Electron Devices Meeting - Si Trench Around Drain (STAD) technology of GaN-DHFETs on Si substrate for boosting power performance

Srivastava, P., Oprins, H., Van Hove, M., Das, J., Malinowski, P.E., Bakeroot, B., Marcon, D., Visalli, D., Kang, X., Lenci, S., Geens, K., Viaene, J., Cheng, K., Leys, M., De Wolf, I., Decoutere, S.,

Year:

2011

Language:

english

File:

PDF, 350 KB

english, 2011

40

Three-Dimensional Asymmetric Flow and Temperature Fields in Cracking Furnaces †

Oprins, Arno J. M., Heynderickx, Geraldine J., Marin, Guy B.

Journal:

Industrial & Engineering Chemistry Research

Year:

2001

Language:

english

File:

PDF, 143 KB

english, 2001

41

Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact

Maggioni, F.L.T., Oprins, H., Beyne, E., De Wolf, I., Baelmans, M.

Journal:

Microelectronics Journal

Year:

2014

Language:

english

File:

PDF, 1.97 MB

english, 2014

42

Tumor necrosis factor α (TNFα) potentialtes the ion secretion in mouse distal colon

Oprins, Judith Cj, Burg, Claudia Van der, Groot, Jack A.

Journal:

Gastroenterology

Year:

2001

Language:

english

File:

PDF, 192 KB

english, 2001

43

β-COP Localizes Mainly to the cis-Golgi Side in Exocrine Pancreas

Ad Oprins, Rainer Duden, Thomas E. Kreis, Hans J. Geuze and Jan W. Slot

Journal:

The Journal of Cell Biology

Year:

1993

Language:

english

File:

PDF, 4.80 MB

english, 1993

44

The Exocyst Component Sec5 Is Present on Endocytic Vesicles in the Oocyte of Drosophila melonogoster

Bernhard Sommer, Adrian Oprins, Catherine Rabouille and Sean Munro

Journal:

The Journal of Cell Biology

Year:

2005

Language:

english

File:

PDF, 4.10 MB

english, 2005

45

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Generic thermal modeling study of the impact of 3D -interposer material and thickness options on the thermal performance and die-to-die thermal coupling

Oprins, H., Beyne, E.

Year:

2014

Language:

english

File:

PDF, 794 KB

english, 2014

46

The Influence of Automation Support on Performance, Workload, and Situation Awareness of Air Traffic Controllers

van de Merwe, Koen, Oprins, Esther, Eriksson, Fredrik, van der Plaat, Akos

Journal:

International Journal of Aviation Psychology

Year:

2012

Language:

english

File:

PDF, 516 KB

english, 2012

47

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

Oprins, H., Cherman, V., Torregiani, C., Stucchi, M., Vandevelde, B., Beyne, E.

Year:

2010

Language:

english

File:

PDF, 1.43 MB

english, 2010

48

[IEEE 2010 International Conference on Microelectronic Test Structures (ICMTS) - Hiroshima, Japan (2010.03.22-2010.03.25)] 2010 International Conference on Microelectronic Test Structures (ICMTS) - Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design

Minas, Nikolaos, Van der Plas, Geert, Oprins, Herman, Yang, Yu, Okoro, Chuckwudi, Mercha, Abdelkarim, Cherman, Vladimir, Torregiani, Cristina, Perry, Dan, Cupac, Miro, Rakowski, Michal, Marchal, Pol

Year:

2010

Language:

english

File:

PDF, 4.13 MB

english, 2010

49

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Temperature dependent electrical characteristics of through-si-via (TSV) interconnections

Katti, G., Mercha, A., Stucchi, M., Tokei, Zs., Velenis, D., Van Olmen, J., Huyghebaert, C., Jourdain, A., Rakowski, M., Debusschere, I., Soussan, P., Oprins, H., Dehaene, W., De Meyer, K., Travaly, Y

Year:

2010

Language:

english

File:

PDF, 485 KB

english, 2010

50

[IEEE 2010 IEEE 16th International On-Line Testing Symposium (IOLTS 2010) - Corfu, Greece (2010.07.5-2010.07.7)] 2010 IEEE 16th International On-Line Testing Symposium - 3D integration: Circuit design, test, and reliability challenges

Minas, Nikolaos, De Wolf, Ingrid, Marinissen, Erik Jan, Stucchi, Michele, Oprins, Herman, Mercha, Abdelkarim, Van der Plaas, Geert, Velenis, Dimitrios, Marchai, Pol

Year:

2010

File:

PDF, 62 KB

2010